A5191HRTNG-XTP
vs
A5191HRTLG-XTD
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Part Package Code |
QFN32, 5x5, 0.5P, 3.1x3.1EP
|
LQFP32, 7x7
|
| Package Description |
QFN-32
|
LQFP-32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
488AM
|
561AB
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
10 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| Data Rate |
1 Mbps
|
1 Mbps
|
| JESD-30 Code |
S-XQCC-N32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LQFP
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.6 mm
|
| Supply Current-Max |
0.0006 mA
|
0.0006 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
MODEM
|
MODEM
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
5 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare A5191HRTNG-XTP with alternatives