A42MX36-FBG272M vs A42MX36-FBGG272 feature comparison

A42MX36-FBG272M Microchip Technology Inc

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A42MX36-FBGG272 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description PLASTIC, BGA-272 ROHS COMPLIANT, PLASTIC, BGA-272
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY ALSO OPERATES AT 5V SUPPLY
Combinatorial Delay of a CLB-Max 3.8 ns 3.8 ns
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1184 2438
Number of Equivalent Gates 54000 54000
Number of Inputs 202
Number of Logic Cells 2414
Number of Outputs 202
Number of Terminals 272 272
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1184 CLBS, 54000 GATES 2438 CLBS, 54000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 2.5 mm
Supply Voltage-Max 5.5 V 3.6 V
Supply Voltage-Min 4.5 V 3 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 3 4
Clock Frequency-Max 44 MHz
Packing Method TRAY

Compare A42MX36-FBG272M with alternatives

Compare A42MX36-FBGG272 with alternatives