A42MX36-BGG272M
vs
A42MX36-BG272I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
ROHS COMPLIANT, PLASTIC, BGA-272
|
BGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
ALSO OPERATES AT 5V SUPPLY
|
Clock Frequency-Max |
73 MHz
|
73 MHz
|
Combinatorial Delay of a CLB-Max |
2.7 ns
|
2.7 ns
|
JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
JESD-609 Code |
e1
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2438
|
2438
|
Number of Equivalent Gates |
54000
|
54000
|
Number of Inputs |
202
|
|
Number of Outputs |
202
|
|
Number of Terminals |
272
|
272
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
1184 CLBS, 54000 GATES
|
2438 CLBS, 54000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.5 mm
|
2.5 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
3
|
3
|
Part Package Code |
|
BGA
|
Pin Count |
|
272
|
|
|
|
Compare A42MX36-BGG272M with alternatives
Compare A42MX36-BG272I with alternatives