A42MX36-2BGG272M
vs
A42MX36-FBG272I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
PLASTIC, BGA-272
BGA, BGA272,20X20,50
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY
CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY
Clock Frequency-Max
91 MHz
Combinatorial Delay of a CLB-Max
2.1 ns
3.8 ns
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1184
1184
Number of Equivalent Gates
54000
54000
Number of Inputs
202
202
Number of Outputs
202
202
Number of Terminals
272
272
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
1184 CLBS, 54000 GATES
1184 CLBS, 54000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max
3.6 V
5.5 V
Supply Voltage-Min
3 V
4.5 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
3
Number of Logic Cells
2414
Compare A42MX36-2BGG272M with alternatives
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