A42MX09-3PQ100MX79
vs
A42MX09-3PQG100M
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
PLASTIC, QFP-100
|
PLASTIC, QFP-100
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY
|
CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY
|
| Combinatorial Delay of a CLB-Max |
1.6 ns
|
1.2 ns
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
336
|
336
|
| Number of Equivalent Gates |
14000
|
14000
|
| Number of Inputs |
104
|
83
|
| Number of Logic Cells |
684
|
684
|
| Number of Outputs |
104
|
83
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
336 CLBS, 14000 GATES
|
684 CLBS, 14000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP100,.7X.9
|
QFP100,.7X.9
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
3
|
3
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Clock Frequency-Max |
|
268 MHz
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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