A42MX09-1PQG100M
vs
A42MX09-1PQG100I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFP,
|
ROHS COMPLIANT, PLASTIC, QFP-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
ALSO OPERATES AT 5V SUPPLY
|
| Clock Frequency-Max |
135 MHz
|
135 MHz
|
| Combinatorial Delay of a CLB-Max |
2.1 ns
|
2.1 ns
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
684
|
684
|
| Number of Equivalent Gates |
14000
|
14000
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
684 CLBS, 14000 GATES
|
684 CLBS, 14000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
10 Weeks
|
| Packing Method |
|
TRAY
|
|
|
|
Compare A42MX09-1PQG100M with alternatives
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