A42MX09-1PL84
vs
A42MX09-PL84IX79
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Part Package Code |
LCC
|
|
| Package Description |
PLASTIC, LCC-84
|
QCCJ,
|
| Pin Count |
84
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES AT 5V SUPPLY
|
ALSO OPERATE AT 5.0V SUPPLY
|
| Clock Frequency-Max |
135 MHz
|
117 MHz
|
| Combinatorial Delay of a CLB-Max |
2.1 ns
|
2.5 ns
|
| JESD-30 Code |
S-PQCC-J84
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
|
| Length |
29.3116 mm
|
29.3116 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
684
|
336
|
| Number of Equivalent Gates |
14000
|
14000
|
| Number of Terminals |
84
|
84
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
684 CLBS, 14000 GATES
|
336 CLBS, 14000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
4.57 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
29.3116 mm
|
29.3116 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare A42MX09-1PL84 with alternatives
Compare A42MX09-PL84IX79 with alternatives