A3PN060-1VQG100I
vs
A3PN060-1VQ100
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP,
14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Length
14 mm
14 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Terminals
100
100
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
TFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
FLATPACK, THIN PROFILE, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
3
3
Factory Lead Time
8 Weeks
JESD-609 Code
e0
Packing Method
TRAY
Terminal Finish
TIN LEAD
Compare A3PN060-1VQG100I with alternatives
Compare A3PN060-1VQ100 with alternatives