Findchips: Compare A3PE600-FG256 vs A3PE600-1FG256

A3PE600-FG256 vs A3PE600-1FG256 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA, BGA256,16X16,40	BGA,
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	13824	13824
Number of Equivalent Gates	600000	600000
Number of Inputs	165
Number of Logic Cells	13824
Number of Outputs	165
Number of Terminals	256	256
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Organization	13824 CLBS, 600000 GATES	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.8 mm	1.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	3
Samacsys Manufacturer		Microsemi Corporation
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays