A3PE3000-FG484
vs
A3PE3000-FGG484
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ACTEL CORP
MICROCHIP TECHNOLOGY INC
Package Description
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code
compliant
compliant
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
75264
75264
Number of Equivalent Gates
3000000
3000000
Number of Inputs
341
341
Number of Logic Cells
75264
75264
Number of Outputs
341
341
Number of Terminals
484
484
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
75264 CLBS, 3000000 GATES
75264 CLBS, 3000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
3
3
ECCN Code
3A991.D
HTS Code
8542.31.00.01
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Microchip
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare A3PE3000-FGG484 with alternatives