A3PE3000-1FG896 vs A3PE3000-1FGG896 feature comparison

A3PE3000-1FG896 Microsemi Corporation

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A3PE3000-1FGG896 Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 75264 75264
Number of Equivalent Gates 3000000 3000000
Number of Terminals 896 896
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 75264 CLBS, 3000000 GATES 75264 CLBS, 3000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 3 3
Samacsys Manufacturer Microsemi Corporation
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare A3PE3000-1FG896 with alternatives

Compare A3PE3000-1FGG896 with alternatives