A3PE3000-1FG896
vs
A3PE3000-1FGG896
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA,
BGA,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B896
S-PBGA-B896
JESD-609 Code
e0
e1
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
75264
75264
Number of Equivalent Gates
3000000
3000000
Number of Terminals
896
896
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
75264 CLBS, 3000000 GATES
75264 CLBS, 3000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA896,30X30,40
BGA896,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
31 mm
31 mm
Base Number Matches
3
3
Samacsys Manufacturer
Microsemi Corporation
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare A3PE3000-1FG896 with alternatives
Compare A3PE3000-1FGG896 with alternatives