A3PE1500-2FGG484
vs
M1A3PE1500-FG484I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
38400
38400
Number of Equivalent Gates
1500000
1500000
Number of Terminals
484
484
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
38400 CLBS, 1500000 GATES
38400 CLBS, 1500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
23 mm
Base Number Matches
12
1
Factory Lead Time
12 Weeks
Clock Frequency-Max
350 MHz
Number of Inputs
280
Number of Logic Cells
38400
Number of Outputs
280
Package Equivalence Code
BGA484,22X22,40
Packing Method
TRAY
Compare A3PE1500-2FGG484 with alternatives
Compare M1A3PE1500-FG484I with alternatives