Findchips: Compare A3P600-PQG208YI vs A3P600-PQ208Y

A3P600-PQG208YI vs A3P600-PQ208Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	FQFP,	FQFP,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PQFP-G208	S-PQFP-G208
Length	28 mm	28 mm
Moisture Sensitivity Level	3
Number of CLBs	13824	13824
Number of Equivalent Gates	600000	600000
Number of Terminals	208	208
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	13824 CLBS, 600000 GATES	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	FQFP	FQFP
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	4.1 mm	4.1 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	COMMERCIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30
Width	28 mm	28 mm
Base Number Matches	3	3
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays