A3P600-FGG256Y
vs
A3P600-FG256
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
ACTEL CORP
Part Package Code
BGA
Package Description
LBGA,
1 MM PITCH, FBGA-256
Pin Count
256
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
3
3
Rohs Code
Package Equivalence Code
BGA256,16X16,40
Qualification Status
Not Qualified
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