A3P600-FGG256I
vs
A3P600-FGG256IY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ACTEL CORP
MICROCHIP TECHNOLOGY INC
Package Description
1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code
unknown
compliant
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
1.7 mm
Number of Equivalent Gates
600000
600000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
17 mm
17 mm
Base Number Matches
3
2
HTS Code
8542.39.00.01
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Inputs
177
Number of Outputs
177
Seated Height-Max
1.7 mm
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