A3P600-FGG144YI vs A3P600-2PQG208 feature comparison

A3P600-FGG144YI Microsemi Corporation

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A3P600-2PQG208 Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description LBGA, 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.31.00.01
JESD-30 Code S-PBGA-B144 S-PQFP-G208
JESD-609 Code e1 e3
Length 13 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Terminals 144 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA FQFP
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 260 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 28 mm
Base Number Matches 2 10
ECCN Code EAR99
Factory Lead Time 14 Weeks
Clock Frequency-Max 350 MHz
Number of Inputs 154
Number of Outputs 154
Packing Method TRAY
Qualification Status Not Qualified

Compare A3P600-FGG144YI with alternatives

Compare A3P600-2PQG208 with alternatives