Findchips: Compare A3P600-FG256II vs A3P600-FG256YI

A3P600-FG256II vs A3P600-FG256YI feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA,	LBGA,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
Length	17 mm	17 mm
Number of CLBs	13824	13824
Number of Equivalent Gates	600000	600000
Number of Terminals	256	256
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	13824 CLBS, 600000 GATES	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	LBGA
Package Equivalence Code	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	1.8 mm	1.7 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	17 mm	17 mm
Base Number Matches	3	3
Rohs Code		No
JESD-609 Code		e0
Moisture Sensitivity Level		3
Terminal Finish		TIN LEAD SILVER
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays