A3P600-FG144I
vs
A3P600-FGG144Y
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
ACTEL CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
1 MM PITCH, FBGA-144
|
LBGA,
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
Length |
13 mm
|
13 mm
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA144,12X12,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
3
|
3
|
Part Package Code |
|
BGA
|
Pin Count |
|
144
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
13824
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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