A3P600-2PQG208I
vs
A3P600-2FGG144Y
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
FQFP,
|
LBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B144
|
JESD-609 Code |
e3
|
e1
|
Length |
28 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
13824
|
13824
|
Number of Equivalent Gates |
600000
|
600000
|
Number of Terminals |
208
|
144
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.1 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
28 mm
|
13 mm
|
Base Number Matches |
3
|
3
|
Part Package Code |
|
BGA
|
Pin Count |
|
144
|
Package Equivalence Code |
|
BGA144,12X12,40
|
|
|
|
Compare A3P600-2PQG208I with alternatives
Compare A3P600-2FGG144Y with alternatives