A3P600-2PQG208I
vs
A3P600-2FGG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
FQFP,
LBGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B144
JESD-609 Code
e3
e1
Length
28 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
208
144
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
245
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
4.1 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
28 mm
13 mm
Base Number Matches
7
4
Part Package Code
BGA
Pin Count
144
Package Equivalence Code
BGA144,12X12,40
Compare A3P600-2PQG208I with alternatives
Compare A3P600-2FGG144Y with alternatives