A3P400-PQ208YI
vs
M1A3P400-1FGG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FQFP,
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
Length
28 mm
17 mm
Number of CLBs
9216
9216
Number of Equivalent Gates
400000
400000
Number of Terminals
208
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
9216 CLBS, 400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
4.1 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
17 mm
Base Number Matches
3
3
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Inputs
178
Number of Outputs
178
Peak Reflow Temperature (Cel)
250
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P400-PQ208YI with alternatives
Compare M1A3P400-1FGG256YI with alternatives