A3P400-FGG144
vs
A3P400-FGG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
ACTEL CORP
MICROCHIP TECHNOLOGY INC
Package Description
1 MM PITCH, GREEN, FBGA-144
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FPBGA-144
Reach Compliance Code
unknown
compliant
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
13 mm
13 mm
Number of Equivalent Gates
400000
400000
Number of Terminals
144
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
HTS Code
8542.39.00.01
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of CLBs
9216
Number of Inputs
97
Number of Outputs
97
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
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