Findchips: Compare A3P400-FG144II vs A3P400-FGG144IY

A3P400-FG144II vs A3P400-FGG144IY feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	LBGA,	FPBGA-144
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz	350 MHz
JESD-30 Code	S-PBGA-B144	S-PBGA-B144
Length	13 mm	13 mm
Number of CLBs	9216
Number of Equivalent Gates	400000	400000
Number of Terminals	144	144
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	9216 CLBS, 400000 GATES	400000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	LBGA
Package Equivalence Code	BGA144,12X12,40	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	1.55 mm	1.55 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	13 mm	13 mm
Base Number Matches	3	2
Rohs Code		Yes
Date Of Intro		2016-03-25
Additional Feature		TERM PITCH-MIN
Moisture Sensitivity Level		3
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays