A3P400-2PQ208YI
vs
A3P400-FGG256IY
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208
|
FPBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
Length |
28 mm
|
17 mm
|
Number of CLBs |
9216
|
|
Number of Equivalent Gates |
400000
|
400000
|
Number of Terminals |
208
|
256
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
9216 CLBS, 400000 GATES
|
400000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
4.1 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
Date Of Intro |
|
2016-03-25
|
Additional Feature |
|
TERM PITCH-MIN
|
Clock Frequency-Max |
|
350 MHz
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
250
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P400-2PQ208YI with alternatives
Compare A3P400-FGG256IY with alternatives