A3P400-2FGG484II
vs
M1A3P400-FG256Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FPBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B256
Length
23 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9216
9216
Number of Equivalent Gates
400000
400000
Number of Terminals
484
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
9216 CLBS, 400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
17 mm
Base Number Matches
2
2
JESD-609 Code
e0
Number of Inputs
178
Number of Outputs
178
Terminal Finish
TIN LEAD
Compare A3P400-2FGG484II with alternatives
Compare M1A3P400-FG256Y with alternatives