A3P400-2FG256I
vs
A3P400-2FG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ACTEL CORP
MICROSEMI CORP
Package Description
1 MM PITCH, FBGA-256
LBGA,
Reach Compliance Code
unknown
compliant
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Number of Equivalent Gates
400000
400000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
3
HTS Code
8542.39.00.01
JESD-609 Code
e0
Moisture Sensitivity Level
3
Number of CLBs
9216
Seated Height-Max
1.7 mm
Terminal Finish
TIN LEAD
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