A3P250L-PQ208I
vs
A3P250L-1FG256Y
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
250 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e0
e0
Length
28 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6144
6144
Number of Equivalent Gates
250000
250000
Number of Inputs
151
157
Number of Logic Cells
6144
6144
Number of Outputs
151
157
Number of Terminals
208
256
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
BGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
17 mm
Base Number Matches
1
2
Compare A3P250L-PQ208I with alternatives
Compare A3P250L-1FG256Y with alternatives