Findchips: Compare A3P250L-1PQ208YI vs A3P250L-FG256Y

A3P250L-1PQ208YI vs A3P250L-FG256Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	QFP, QFP208,1.2SQ,20	BGA, BGA256,16X16,40
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	250 MHz	250 MHz
JESD-30 Code	S-PQFP-G208	S-PBGA-B256
Number of Inputs	151	157
Number of Logic Cells	6144	6144
Number of Outputs	151	157
Number of Terminals	208	256
Operating Temperature-Max	85 °C	70 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	QFP	BGA
Package Equivalence Code	QFP208,1.2SQ,20	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	COMMERCIAL
Terminal Form	GULL WING	BALL
Terminal Pitch	0.5 mm	1 mm
Terminal Position	QUAD	BOTTOM
Base Number Matches	3	3
JESD-609 Code		e0
Moisture Sensitivity Level		3
Terminal Finish		TIN LEAD
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays