A3P250L-1PQ208YI
vs
A3P250L-1FG256YI
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
QFP, QFP208,1.2SQ,20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
250 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
Number of Inputs
151
157
Number of Logic Cells
6144
6144
Number of Outputs
151
157
Number of Terminals
208
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
BGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Base Number Matches
3
3
JESD-609 Code
e0
Length
17 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
250000
Organization
6144 CLBS, 250000 GATES
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Terminal Finish
TIN LEAD
Width
17 mm
Compare A3P250L-1PQ208YI with alternatives
Compare A3P250L-1FG256YI with alternatives