A3P250L-1PQ208YI vs A3P250L-1FG256YI feature comparison

A3P250L-1PQ208YI Microsemi Corporation

Buy Now Datasheet

A3P250L-1FG256YI Microchip Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description QFP, QFP208,1.2SQ,20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B256
Number of Inputs 151 157
Number of Logic Cells 6144 6144
Number of Outputs 151 157
Number of Terminals 208 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Base Number Matches 3 3
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 6144
Number of Equivalent Gates 250000
Organization 6144 CLBS, 250000 GATES
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Terminal Finish TIN LEAD
Width 17 mm

Compare A3P250L-1PQ208YI with alternatives

Compare A3P250L-1FG256YI with alternatives