A3P250-QN132II
vs
A3P250-1FGG256II
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
VBCC,
|
BGA,
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
350 MHz
|
| JESD-30 Code |
S-XBCC-B132
|
S-PBGA-B256
|
| Length |
8 mm
|
17 mm
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
250000
|
250000
|
| Number of Terminals |
132
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VBCC
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
1.8 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BUTT
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
17 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Peak Reflow Temperature (Cel) |
|
250
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P250-QN132II with alternatives
Compare A3P250-1FGG256II with alternatives