A3P250-FGG256IY
vs
A3P250-FG256T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s)
30
20
Base Number Matches
2
3
Package Description
BGA, BGA256,16X16,40
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Inputs
157
Number of Logic Cells
6144
Number of Outputs
157
Number of Terminals
256
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Compare A3P250-FGG256IY with alternatives
Compare A3P250-FG256T with alternatives