A3P250-FGG256IY
vs
A3P250-1QN132II
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Package Description
VBCC,
Clock Frequency-Max
350 MHz
JESD-30 Code
S-XBCC-B132
Length
8 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Terminals
132
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
Package Body Material
UNSPECIFIED
Package Code
VBCC
Package Shape
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
Qualification Status
Not Qualified
Seated Height-Max
0.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BUTT
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
Width
8 mm
Compare A3P250-FGG256IY with alternatives
Compare A3P250-1QN132II with alternatives