A3P250-FG256II
vs
A3P250-FG256T
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
BGA, BGA256,16X16,40
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
350 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Number of CLBs |
6144
|
6144
|
Number of Equivalent Gates |
250000
|
250000
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
1.8 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
3
|
3
|
Rohs Code |
|
No
|
Samacsys Manufacturer |
|
Microsemi Corporation
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
157
|
Number of Logic Cells |
|
6144
|
Number of Outputs |
|
157
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
225
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare A3P250-FG256II with alternatives
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