A3P250-FG256I
vs
A3P250-2VQG100
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ACTEL CORP
|
| Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
0.50 MM PITCH, GREEN, VQFP-100
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
52 Weeks, 2 Days
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Clock Frequency-Max |
350 MHz
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
17 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
6144
|
|
| Number of Equivalent Gates |
250000
|
250000
|
| Number of Inputs |
157
|
|
| Number of Outputs |
157
|
|
| Number of Terminals |
256
|
100
|
| Operating Temperature-Max |
100 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
6144 CLBS, 250000 GATES
|
250000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
17 mm
|
14 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
Compare A3P250-FG256I with alternatives