A3P250-FG144I vs A3P250-1QNG132YT feature comparison

A3P250-FG144I Microsemi Corporation

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A3P250-1QNG132YT Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description LBGA, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144
JESD-609 Code e0
Length 13 mm
Moisture Sensitivity Level 3
Number of CLBs 6144
Number of Equivalent Gates 250000
Number of Terminals 144
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 235
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm
Base Number Matches 9 1

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Compare A3P250-1QNG132YT with alternatives