A3P250-FG144I vs A3P250-FG144YT feature comparison

A3P250-FG144I Microchip Technology Inc

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A3P250-FG144YT Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51 8542.39.00.01
Samacsys Manufacturer Microchip
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144
Number of Equivalent Gates 250000 250000
Number of Terminals 144 144
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 6144 CLBS, 250000 GATES 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 235
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 13 mm 13 mm
Base Number Matches 6 1
Number of Inputs 97
Number of Logic Cells 6144
Number of Outputs 97
Package Equivalence Code BGA144,12X12,40
Screening Level AEC-Q100

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