A3P250-FG144I
vs
A3P250-FG144Y
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
|
LBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.51
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e0
|
e0
|
Length |
13 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6144
|
6144
|
Number of Equivalent Gates |
250000
|
250000
|
Number of Inputs |
97
|
|
Number of Outputs |
97
|
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA144,12X12,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Packing Method |
TRAY
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
6
|
6
|
Part Package Code |
|
BGA
|
Pin Count |
|
144
|
|
|
|
Compare A3P250-FG144I with alternatives
Compare A3P250-FG144Y with alternatives