A3P250-2PQG208YI
vs
A3P250-1QNGG132C
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G208
|
|
Length |
28 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
6144
|
|
Number of Equivalent Gates |
250000
|
|
Number of Inputs |
151
|
|
Number of Outputs |
151
|
|
Number of Terminals |
208
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
6144 CLBS, 250000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FQFP
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
4.1 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
28 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare A3P250-2PQG208YI with alternatives
Compare A3P250-1QNGG132C with alternatives