A3P250-2FGG256I
vs
A3P250-2FGG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ACTEL CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
1 MM PITCH, GREEN, FBGA-256
LBGA,
Reach Compliance Code
unknown
unknown
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Number of Equivalent Gates
250000
250000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
3
Part Package Code
BGA
Pin Count
256
HTS Code
8542.39.00.01
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of CLBs
6144
Peak Reflow Temperature (Cel)
250
Seated Height-Max
1.7 mm
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P250-2FGG256YI with alternatives