A3P250-2FGG144YI
vs
A3P250-2FGG144I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
ACTEL CORP
Part Package Code
BGA
Package Description
LBGA,
1 MM PITCH, GREEN, FBGA-144
Pin Count
144
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
Length
13 mm
13 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
250000
250000
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
6144 CLBS, 250000 GATES
250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
3
3
Rohs Code
Qualification Status
Not Qualified
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