A3P250-2FG256Y
vs
A3P250-2FGG256IY
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
|
JESD-609 Code |
e0
|
|
Length |
17 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
6144
|
|
Number of Equivalent Gates |
250000
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
6144 CLBS, 250000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
TIN LEAD SILVER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
17 mm
|
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
250
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P250-2FG256Y with alternatives
Compare A3P250-2FGG256IY with alternatives