A3P250-1QN132YT
vs
A3P250-1QN132
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
| Package Description |
,
|
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-30 Code |
|
S-XBCC-B132
|
| Length |
|
8 mm
|
| Number of CLBs |
|
6144
|
| Number of Equivalent Gates |
|
250000
|
| Number of Terminals |
|
132
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
6144 CLBS, 250000 GATES
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
HVBCC
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.8 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
BUTT
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
8 mm
|
|
|
|
Compare A3P250-1QN132YT with alternatives
Compare A3P250-1QN132 with alternatives