A3P250-1FGG256T
vs
A3P250-1FGG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
BGA, BGA256,16X16,40
LBGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6144
6144
Number of Equivalent Gates
250000
250000
Number of Inputs
157
Number of Logic Cells
6144
Number of Outputs
157
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
6144 CLBS, 250000 GATES
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1.8 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
3
3
Part Package Code
BGA
Pin Count
256
Compare A3P250-1FGG256T with alternatives
Compare A3P250-1FGG256YI with alternatives