Findchips: Compare A3P250-1FGG256 vs A3P250-1FG256I

A3P250-1FGG256 vs A3P250-1FG256I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA,	BGA,
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e1
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	6144	6144
Number of Equivalent Gates	250000	250000
Number of Terminals	256	256
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	6144 CLBS, 250000 GATES	6144 CLBS, 250000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	250
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.8 mm	1.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm	17 mm
Base Number Matches	3	3
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays