A3P250-1FG256T
vs
A3P250-VQ100M
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
1 MM PITCH, FBGA-256
|
TFQFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
350 MHz
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
17 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
6144
|
6144
|
| Number of Equivalent Gates |
250000
|
250000
|
| Number of Inputs |
157
|
|
| Number of Logic Cells |
6144
|
|
| Number of Outputs |
157
|
|
| Number of Terminals |
256
|
100
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
6144 CLBS, 250000 GATES
|
6144 CLBS, 250000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFQFP
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Packing Method |
TRAY
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.8 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
TIN LEAD SILVER
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
17 mm
|
14 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare A3P250-1FG256T with alternatives
Compare A3P250-VQ100M with alternatives