Findchips: Compare A3P125-QN132I vs A3P125-QN132II

A3P125-QN132I vs A3P125-QN132II feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	ACTEL CORP
Package Description	8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132	8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01
JESD-30 Code	S-XBCC-B132	S-XBCC-B132
Length	8 mm	8 mm
Number of CLBs	3072	3072
Number of Equivalent Gates	125000	125000
Number of Terminals	132	132
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	3072 CLBS, 125000 GATES	3072 CLBS, 125000 GATES
Package Body Material	UNSPECIFIED	UNSPECIFIED
Package Code	HVBCC	VBCC
Package Shape	SQUARE	SQUARE
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	235
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	0.8 mm	0.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BUTT	BUTT
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	20
Width	8 mm	8 mm
Base Number Matches	2	2
Clock Frequency-Max		350 MHz
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays