A3P125-FGG144YT
vs
A3P125-FG144C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROSEMI CORP
Package Description
,
LBGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-609 Code
e1
e0
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
3
3
Rohs Code
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
Length
13 mm
Number of CLBs
3072
Number of Equivalent Gates
125000
Number of Terminals
144
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
3072 CLBS, 125000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
Compare A3P125-FGG144YT with alternatives
Compare A3P125-FG144C with alternatives