A3P125-FG144YC
vs
A3P125-FG144I
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
3
|
3
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-30 Code |
|
S-PBGA-B144
|
| Length |
|
13 mm
|
| Number of CLBs |
|
3072
|
| Number of Equivalent Gates |
|
125000
|
| Number of Inputs |
|
97
|
| Number of Outputs |
|
97
|
| Number of Terminals |
|
144
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
3072 CLBS, 125000 GATES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LBGA
|
| Package Equivalence Code |
|
BGA144,12X12,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE
|
| Packing Method |
|
TRAY
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.55 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
13 mm
|
|
|
|
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