A3P125-1QNGG132YC vs A3P125-1QN132I feature comparison

A3P125-1QNGG132YC Microsemi Corporation

Buy Now Datasheet

A3P125-1QN132I Microsemi Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Base Number Matches 2 2
Rohs Code No
Package Description 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
JESD-30 Code S-XBCC-B132
Length 8 mm
Number of CLBs 3072
Number of Equivalent Gates 125000
Number of Terminals 132
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 3072 CLBS, 125000 GATES
Package Body Material UNSPECIFIED
Package Code HVBCC
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BUTT
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm

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