A3P1000L-FGG484YI
vs
A3P600L-FGG484
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
ACTEL CORP
Package Description
BGA, BGA484,22X22,40
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Clock Frequency-Max
250 MHz
350 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Moisture Sensitivity Level
3
3
Number of Inputs
300
235
Number of Logic Cells
24576
13824
Number of Outputs
300
235
Number of Terminals
484
484
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
3
3
Rohs Code
Yes
Length
23 mm
Number of CLBs
13824
Number of Equivalent Gates
600000
Organization
13824 CLBS, 600000 GATES
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Width
23 mm
Compare A3P1000L-FGG484YI with alternatives