A3P1000L-FGG484YI vs A3P600L-FGG484 feature comparison

A3P1000L-FGG484YI Microsemi FPGA & SoC

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A3P600L-FGG484 Actel Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP ACTEL CORP
Package Description BGA, BGA484,22X22,40 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Clock Frequency-Max 250 MHz 350 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Moisture Sensitivity Level 3 3
Number of Inputs 300 235
Number of Logic Cells 24576 13824
Number of Outputs 300 235
Number of Terminals 484 484
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 3 3
Rohs Code Yes
Length 23 mm
Number of CLBs 13824
Number of Equivalent Gates 600000
Organization 13824 CLBS, 600000 GATES
Seated Height-Max 2.44 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Width 23 mm

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